Peltier Device Based On Flexible Printed Circuit Substrate

Conventional Peltier devices are based on ceramic substrates with specific shapes, hence this places pre-design constraints on the form factor that the final product can take. In addition, it is difficult to customise the conventional Peltier devices in terms of their thermal and electrical parameters, as usually, they are offered as standard products. 

This technology offer is a Peltier device that is based on flexible printed circuit (FPC) substrate. As such, the Peltier device is thinner, and can be easily integrated into an end product. Moreover, customisation of the Peltier device's form factor and performance parameters can be done, so that the final product can achieve an optimal thermal and electrical performance.

1. FPC Connection to the End Product/System
Usually, Peltier devices are connected by conventional lead wires. This technology offer uses FPC traces instead, thus making it easier to implement the interconnects design.

2. FPC Substrate
Conventionally, Peltier devices use a ceramic substrate. This technology offer uses FPC substrate, which has the following merits:
a. Thinner than ceramic, hence enabling ease of design and integration
b. Faster temperature change, hence enabling faster test time, e.g., polymerase chain reaction (PCR)
c. FPC has copper layer which has high heat conduction, hence the Peltier device has better uniformity

3. Built-in Thermistor
A thermistor can be integrated into the Peltier device itself, so that the Peltier device's temperature can be measured directly. This makes it possible to implement self-testing to troubleshoot and isolate the cause of deterioration in the Peltier device. If deterioration is detected, the input current can be adjusted to maintain the Peltier device's performance.
  
4. Custom Design Support for Collaborator’s Product/System
The Peltier device is fully customisable according to the collaborator's design requirements, in any combination of the above features.

This technology offer is suitable for products/systems with small form factors or space constraints, or products/systems requiring rapid temperature changes. Examples include:

1. In the field of the metaverse and haptics, small form factor game controllers with haptics function can be integrated with this technology, to implement the function of hot/cold sensations conveyed to the user's hand. The fast reaction of the Peltier, coupled with the internal thermistor, enables the temperature below the substrate to be known and controlled precisely.

2. In PCR equipment, no additional temperature detector is required, thus simplifying the design, and contributes to better heat conduction which shortens the reaction time of the PCR. The Peltier device itself can also be monitored for any deterioration via the internal thermistor, and compensation can be done accordingly to maintain the PCR performance.

With this technology offer, the collaborator could implement equipment miniaturisation, and achieve improvements in system performance and in assembling the Peltier device. Furthermore, there will be customisation support available from the technology owner to optimise the design and performance parameters, including device/system modelling and simulation based on the collaborator's end application area.

The technology owner is keen to co-develop on this technology offer with hardware design companies and manufacturers.